Duane S. Boning received the S.B. degrees in electrical engineering and in computer science in 1984, and the S.M. and Ph.D. degrees in electrical engineering in 1986 and 1991, respectively, all from the Massachusetts Institute of Technology. He was an NSF Fellow from 1984 to 1989, and an Intel Graduate Fellow in 1990. From 1991 to 1993 he was a Member Technical Staff at the Texas Instruments Semiconductor Process and Design Center in Dallas, Texas, where he worked on semiconductor process representation, process/device simulation tool integration, and statistical modeling and optimization.
Dr. Boning is a Fellow of the IEEE, is Editor in Chief for the IEEE Transactions on Semiconductor Manufacturing, and has served as chairman of the CFI/Technology CAD Framework Semiconductor Process Representation Working Group. He is a member of the IEEE, Electrochemical Society, Eta Kappa Nu, Tau Beta Pi, Materials Research Society, Sigma Xi, and the Association of Computing Machinery.
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Lecture 5: Probability models, parameter estimation, and sampling
as author at MIT 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303),
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Lecture 15: Response surface modeling and process optimization
as author at MIT 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303),
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Lecture 2: Semiconductor process variation
as author at MIT 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303),
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Lecture 1: Introduction — processes and variation framework
as author at MIT 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303),
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Lecture 6: Sampling distributions and statistical hypotheses
as author at MIT 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303),
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Lecture 9: Advanced and multivariate SPC
as author at MIT 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303),
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Lecture 4: Probability models of manufacturing processes
as author at MIT 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303),
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Lecture 8: Process capability and alternative SPC methods
as author at MIT 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303),
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Lecture 10: Yield modeling
as author at MIT 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303),
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Lecture 12 : Full factorial models
as author at MIT 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303),
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Lecture 19: Case study 1: tungsten CVD DOE/RSM
as author at MIT 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303),
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Lecture 13: Modeling testing and fractional factorial models
as author at MIT 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303),
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Lecture 21: Case study 3: spatial modeling
as author at MIT 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303),
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Lecture 16: Process robustness
as author at MIT 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303),
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Lecture 17: Nested variance components
as author at MIT 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303),
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Lecture 14: Aliasing and higher order models
as author at MIT 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303),
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